LED wash wall lamp factory packaging production process is as follows:
1, chip test
Appearance inspection: if there is a mechanical damage and pitting surface pockmark (lockhill) chip size and the size of the electrode is in line with the process requirement electrode design is complete.
2, the expansion of crystal
Due to the LED chip after scribing still closer spacing is small (0.1 mm), is not conducive to the process of operation. We adopt expansion machine to bond chip membrane expansion, is stretching to about 0.6 mm. The LED chip spacing can also manually expansion, but it is easy to cause chips fall as well as the waste problem.
3, solid crystal glue
The corresponding position of the point in LED stent or insulated silver sol. (for GaAs, SiC conductive substrate, a back electrode of red light, yellow light, yellow green chips, using silver glue. For insulating substrate sapphire blue, green LED chips, insulation glue used to attach the chip), evaluate the stand or fall of a silver glue mainly has two points:
One, the viscosity (generally in the 3000-4000 CPS)
Second, the heat conductivity (currently we used is the silver glue EPO - coefficient of thermal conductivity TEK company for 29 w/mk)
Process the difficulty lies in the dispensing quantity control in the colloid height, dispensing position has a detailed technical requirements. Because silver rubber and insulating rubber in the storage and use all have strict requirements, silver glue thaw, mixing, use time are all the items must pay attention to in the process.
4, for solid crystal glue
Contrary to some glue, glue is prepared with rubber prepared first silver glue coated electrode on the back of the LED, and then brought back the silver glue LED is installed on the LED bracket. Efficiency is much higher than for gel point glue, but not all products are suitable for plastic technology (generally applied to make digital tube production above).
5, hand piece
Will be expanded to the LED chip (glue) has not prepared for glue or placed on the table's fixture, LED stent under fixture, under the microscope LED chips one by one with the needle on the corresponding position. Compared to stab manual and automatic rack has a benefit, convenient to change at different chip, is suitable for the need to install a variety of products of the chip.
6, automatic rack
With automatic rack is combined with the adhesive (glue) and install the chip, two steps, the first point of silver glue on the LED bracket (insulated), then the LED chip with a vacuum suction nozzle sucking up mobile location, relocation in the corresponding position. Automatic rack main must be familiar with programming and operation on craft with glue and installation precision of the equipment at the same time to adjust. Choose in as far as possible on the selection of suction nozzle bakelite suction nozzle, prevent damage on the surface of the LED chip, especially the blue and green chips must be made of bakelite. Because the current diffusion layer on the surface of the steel mouth will scratch chip.
7, sintering
Sintering process is the purpose of the silver adhesive curing, sintering required to monitor the temperature, prevent bad batch sex. Silver glue sintered at 150 ℃, the temperature of the general control of sintering time 1.5 hours. Can be adjusted according to actual condition to 170 ℃, 1 hour. Insulated generally 150 ℃, 1